GMG’s THERMAL-XR(R) Demonstrates Potential for Electronics Heat Sink Miniaturization and Efficiency

Graphene Manufacturing Group Ltd. (TSXV: GMG) (OTCQX: GMGMF) (“GMG” or the “Company”) is pleased to provide a business update on the commercialisation progress of THERMAL-XR® Powered by GMG Graphene. CUSTOMER ENGAGEMENT UPDATE GMG continues to make progress in testing with companies in multiple industries for the use of THERMAL-XR® in their products, including on heat sinks for electronics. Figure 1 shows an aluminium heat sink that is commonly used in electronics for removing heat from printed circuit boards, electrical circuits and processing silicon chips, and that has been coated with THERMAL-XR®. HEAT SINK MINIATURISATION: Third-party verified modelling demonstrates that applying THERMAL-XR® to a heat sink could reduce its size by up to 39%, while maintaining equivalent thermal performance, offering the potential for weight and material cost savings. Figure 2 shows that the maximum temperature reached by a heat sink coated with THERMAL-XR® is 62 degrees centigrade, 23% lower than the maximum temperature of 80 degrees Celsius reached by a heat sink of equal size that has not been coated with THERMAL-XR®. Figure 3 shows that a heat sink coated with THERMAL-XR® that is 39% smaller in terms of width achieves the same performance as a heat sink that has not been coated with THERMAL-XR®.